2025 OCP Global Summit on Electronic Design

Check out technology on display at the Open Compute Project summit.
Oct. 16, 2025

What You'll Learn

  • What's new at the OCP Global Summit
  • New technology announced at the summit

The 2025 OCP Global Summit, held in San Jose, Calif., on October 13-16, was sponsored by the Open Compute Project (OCP). OCP defines standards for today's big iron, AI in the cloud. These systems are finding homes in the massive data centers cropping up around the world to feed the artificial intelligence hunger. To make it happen, designers are having to employ the latest in chiplet technology, liquid cooling, and optical interconnects. There was a lot going on at the show, from discussions about the move to 800 V to cooling technologies. 

Latest Content from the OCP Global Summit

NVIDIA
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NVIDIA’s Vera Rubin Compute Tray streamlines liquid-cooled data center implementation.
ASRock Rack (generated with AI)
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ASRock Rack aims to lower temperatures for AI-based industries in collaboration with ZutaCore and its HyperCool waterless system.
ID 76252961 © Vladimir Timofeev | Dreamstime.com
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The company’s innovations, showcased at the OCP Global Summit, are designed to drive the latest AI-based data centers.
ID 369627941 © Denys Hryhor | Dreamstime.com
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Discover how manufacturing breakthroughs, rising demand, new applications, and strategic partnerships are set to revolutionize the future of tactile sensors.

More Content About Data Center Design and OCP

ID 76795646 © Cybrain | Dreamstime.com
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Data centers and cloud data centers employ a lot of hardware and software, much of which is specific to those environments. Designing these systems touches on a range of different...
214182392 © Pavlinec | Dreamstime.com
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Check our more Compute Express Link (CXL) articles and videos.
76795646 © Cybrain | Dreamstime.com
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Network interface cards are much smarter than they used to be.
75868080 © Vladimir Timofeev | Dreamstime.com
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Dive into the complexities of designing and testing power delivery solutions for AI data centers.

About the Author

William G. Wong

Senior Content Director - Electronic Design and Microwaves & RF

I am Editor of Electronic Design focusing on embedded, software, and systems. As Senior Content Director, I also manage Microwaves & RF and I work with a great team of editors to provide engineers, programmers, developers and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our template and send to me along with a signed release form. 

Check out my blog, AltEmbedded on Electronic Design, as well as his latest articles on this site that are listed below. 

You can visit my social media via these links:

I earned a Bachelor of Electrical Engineering at the Georgia Institute of Technology and a Masters in Computer Science from Rutgers University. I still do a bit of programming using everything from C and C++ to Rust and Ada/SPARK. I do a bit of PHP programming for Drupal websites. I have posted a few Drupal modules.  

I still get a hand on software and electronic hardware. Some of this can be found on our Kit Close-Up video series. You can also see me on many of our TechXchange Talk videos. I am interested in a range of projects from robotics to artificial intelligence. 

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