2025 OCP Global Summit on Electronic Design
What You'll Learn
- What's new at the OCP Global Summit
- New technology announced at the summit
The 2025 OCP Global Summit, held in San Jose, Calif., on October 13-16, was sponsored by the Open Compute Project (OCP). OCP defines standards for today's big iron, AI in the cloud. These systems are finding homes in the massive data centers cropping up around the world to feed the artificial intelligence hunger. To make it happen, designers are having to employ the latest in chiplet technology, liquid cooling, and optical interconnects. There was a lot going on at the show, from discussions about the move to 800 V to cooling technologies.
Latest Content from the OCP Global Summit
More Content About Data Center Design and OCP
About the Author
William G. Wong
Senior Content Director - Electronic Design and Microwaves & RF
I am Editor of Electronic Design focusing on embedded, software, and systems. As Senior Content Director, I also manage Microwaves & RF and I work with a great team of editors to provide engineers, programmers, developers and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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Check out my blog, AltEmbedded on Electronic Design, as well as his latest articles on this site that are listed below.
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I earned a Bachelor of Electrical Engineering at the Georgia Institute of Technology and a Masters in Computer Science from Rutgers University. I still do a bit of programming using everything from C and C++ to Rust and Ada/SPARK. I do a bit of PHP programming for Drupal websites. I have posted a few Drupal modules.
I still get a hand on software and electronic hardware. Some of this can be found on our Kit Close-Up video series. You can also see me on many of our TechXchange Talk videos. I am interested in a range of projects from robotics to artificial intelligence.