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Powering Data Centers from the Grid to the to the Processor

June 18, 2025
Dive into the complexities of designing and testing power delivery solutions for AI data centers.

The AI race is running on massive amounts of electricity. U.S. demand for electricity is projected to climb more than 15% by 2030, with data centers among the primary drivers, according to a recent analysis by power sector consulting firm Grid Strategies. To keep up, tech giants such as Google, Meta, Amazon, and Microsoft are all scrambling to secure large amounts of reliable power for their future AI operations, increasingly turning to nuclear power as a way to bypass bottlenecks in the grid.

But as companies focus on supplying power to these data centers, a parallel challenge is arising inside the facilities themselves. Today's graphics processing units (GPUs) and other AI accelerator chips are burning through more than 1000W to run computationally intense workloads, including AI training and inference. These escalating demands are pushing existing power architectures to their limits, with rack-level power densities rising from 10 to 40 kW to as high as 100 to 200 kW in a short span.

As AI chips become more power-hungry, the problem is not going away. The power demands of machine learning are projected to push power-per-rack specifications to more than 500 kW before 2030. The surge is spurring power electronics and systems engineers to reevaluate the entire power architecture in data centers. It is no longer enough to simply deliver more power—it must be converted and distributed efficiently across every stage of the power chain to minimize losses as heat.

At the rack level, technology giants are collaborating on the shift from the industry-standard 48 V DC power distribution to +/-400 V or 800 V DC. At the server level, semiconductor firms are upgrading voltage regulators to sling power faster and more efficiently over the "last inch" of the circuit board and into the point of load (POL) at the GPU or other SoC. Additionally, chip designers are rewiring the power networks inside the processor and the package to improve efficiency.

In this roundup, Electronic Design dives into the details of designing, validating, and testing power delivery solutions for today's data centers. It will cover everything from the complexities of power supplies and the intricacies of voltage regulators to the EDA and test and measurement tools for navigating the issues. In the future, it will elaborate on the challenges of signal (SI) and power integrity (PI)—crucial to designing optimal power delivery networks (PDN)—as well as thermal management.

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The End of the Line for 48-V Power Architectures?

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In this exclusive Q&A, Vicor contends that ±400-V DC power distribution to AI racks in data centers is inevitable.
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Navitas Semiconductor’s next-generation power-supply unit meets OCP requirements for high-power, high-density server racks.
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Is high-voltage DC (HVDC) the future of power distribution in data centers? If so, power-supply designers will have to work through a lot of challenges to make it a reality.

Under the Hood of the Latest AI Power Supply Units

Infineon Technologies
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Explore how SiC and GaN are redefining power-supply design to meet the growing demands of AI SoCs.
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Power density of an AC-DC or DC-DC converter is typically measured in watts of power output per cubic centimeter. The higher the number, the better the power density.
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Stricter guidelines imposed by version 3 of the IEC standard for harmonic current emissions push designers to embrace power-factor-correction methodologies.

The UPS: Rugged, Reliable Backup Power for Data Centers

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Power backups protect data and system reliability in mission-critical infrastructure. What sets supercapacitors and battery-based UPS apart in these rugged computing environments...
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The differences and benefits are compared between traditional monolithic UPS systems versus more newly designed modular UPS systems.

Hot Swapping and High-Current Circuit Protection

Texas Instruments
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eFuses integrate power switches, digital controllers, current sensing, and all of the other smarts for hot swapping in a single chip. For TI, they represent the future of circuit...
ROHM Semiconductor
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ROHM’s latest MOSFETs are re-engineered to handle the rising power demands of AI data centers.
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Protecting a power supply and its load from each other’s faults requires components and functions such as the fuse, undervoltage lockout, crowbars, and clamps.

Voltage Regulators: Bringing Power to the Point of Load

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A deep dive into the challenges of AI power delivery and how startup Empower Semiconductor attempts to tackle them with its Crescendo family of voltage-regulator ICs.
Saras Micro Devices
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STILE is a substrate-embedded, passive module designed by Saras Micro Devices to support the growing number of power rails in high-performance SoCs.
Infineon
Infineon claims that its latest high-density power module can more efficiently deliver power to power-hungry processors and AI chips in data centers.
About the Author

James Morra | Senior Editor

James Morra is a senior editor for Electronic Design, covering the semiconductor industry and new technology trends, with a focus on power electronics and power management. He also reports on the business behind electrical engineering, including the electronics supply chain. He joined Electronic Design in 2015 and is based in Chicago, Illinois.

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