Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 58,600 employees worldwide and generated revenue of about €16.3 billion in the 2023 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY)
Infineon’s automotive-grade MCU and companion software architecture from Munich Electrification deliver precision, safety, and programmability for xEV Li-ion batteries.
Infineon gives vertical power delivery a push with a new generation of multiphase power modules that can be tucked underneath server boards and AI accelerator cards.
In power electronics, silicon carbide beats silicon in most of the metrics that count, except cost. Infineon is trying to tackle the problem with the first fusion power module...
This blog series on Internet of Things security, authored by Infineon’s Zhi Feng, covers the challenges and solutions in building up cyber resilience in IoT devices and systems...
This week’s installment of PowerBites offers up a range of new developments, from an ASIL-D DAQ system to a resettable eFuse to Hybrid IGBTs to GaN power ICs, plus more.
Careful design focusing on reliability, fine-tuning of parameters like gate-oxide thickness, and rigorous FIT-rate testing are essential to meet efficiency demands.
PowerBites wraps up 2020 with another array of power-related newsmakers, from the ever-evolving world of SiC developments, to cooler GaN half-bridges, to an automotive BMU that...
Chips made at the new Dresden fab will support everything from AI data centers to the electric grids, battery storage systems, and renewable energy systems feeding them.
In 2026, several key developments will impact Wi-Fi, from wider Wi-Fi 7 infrastructure adoption to new peer-to-peer capabilities and advances in sensing and locationing.
A wide of array of advanced controllers arrived in 2025, marked by high integration and enhanced intelligence in solutions involving USB and other technologies.
The year 2025 produced a bumper crop of new SiC-, GaN-, and silicon-based power transistors, modules, and other basic building blocks for more robust, efficient, and versatile...
The development kit covers all core building blocks of a zonal controller, which typically needs to tackle everything from data routing to power distribution to load control.
Switching has almost always meant “hard" switching, which is simple but comes with all kinds of electrical and thermal stresses. Soft switching employs more sophisticated design...
Infineon’s reference design for high-power data center power supplies employs advanced power-conversion topologies in both the AC-DC and DC-DC power stages.
Infineon’s CoolGaN 650-V integrated bidirectional switch is a simpler, higher-efficiency alternative to traditional back-to-back configurations commonly used in converters.
Equipped with a seamless GUI and adaptable, hardware-abstracted, motor-control core library, this development platform eases the design and optimization of motor drives.
SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power densities while reducing solution cost. Meanwhile, silicon...
Stellantis and Infineon signed supply and capacity agreements that will serve as the foundation for development of the next-gen power architecture for Stellantis’s EVs.
According to Infineon, these wafers—the thinnest of its type to be mass-produced—will enhance the efficiency, density, and reliability of its power converters.