Wiwynn’s Next-Gen AI Infrastructure and Cooling Tech Targets High-Density Data Centers

The company’s innovations, showcased at the OCP Global Summit, are designed to drive the latest AI-based data centers.
Oct. 16, 2025
2 min read

What you'll learn:

  • Insight into Wiwynn's next generation of server systems and cooling technologies.
  • How the new tech is designed to drive performance while keeping temperatures at low levels.
  • Potential applications for these tech advances.

Next-generation AI infrastructure and cooling technologies unveiled by Wiwynn at the OCP Global Summit 2025 included a lineup of cutting-edge server systems developed in collaboration with Wistron, along with a series of advanced liquid-cooling innovations designed for high-density, AI-driven data centers.

Among the highlights are AI-optimized server systems. They include the NVIDIA GB300 NVL72, a liquid-cooled rack-level AI platform featuring 72 NVIDIA Blackwell Ultra GPUs and ConnectX-8 800Gb/s SuperNICs that are designed for ultra-scale inference and reasoning workloads. And the NVIDIA HGX B300 is an eight-GPU, 10U system equipped with 2.1 TB of HBM3e memory, developed for large-scale AI training.

Not leaving AMD out of the mix, Wiwynn also introduced its AMD Instinct MI350 series system, powered by EPYC CPUs and Pollara 400 AI NICs. It boasts a 35X increase in inference performance over previous generations.

The company's Double-Wide Rack Architecture can accommodate the latest high-power GPUs, including AMD's upcoming MI400 series, which integrates HVDC power, advanced liquid cooling, and optimized signal layouts. This rack design doubles the traditional width, addressing the growing data, power, and thermal requirements commonly associated with large AI systems.

A Cool Development

On the cooling side, Wiwynn introduced a double-sided cold plate capable of handling up to 4 kW of heat dissipation, leveraging microchannel and 3D electrochemical printing technologies. In addition, the company showed off a two-phase cold plate that uses eco-friendly dielectric refrigerants for efficient phase-change heat transfer. Also, a 300-kW AALC Sidecar, developed with Shinwa Controls, brings liquid-cooled rack capability to air-cooled facilities without overhauling infrastructure.

Rounding out the showcase, Wiwynn demonstrated its AI networking solutions. They feature NVIDIA Spectrum-X Ethernet for AI networking, designed around Spectrum-4 MAC technology, and Broadcom's Tomahawk 6 datacenter switch.

"At OCP Global Summit, we're proud to demonstrate our latest accelerated solutions and cooling innovations," said William Lin, President and CEO of Wiwynn. "Together with industry leaders, we're advancing the frontiers of AI computing performance and thermal efficiency. These collaborations enable a comprehensive suite of cutting-edge products that address the surging needs of both modern and legacy data centers in the AI era."

Open Compute Project
promo_ocp__open_compute_project
Check out technology on display at the Open Compute Project summit.

About the Author

Cabe Atwell

Technology Editor, Electronic Design

Cabe is a Technology Editor for Electronic Design. 

Engineer, Machinist, Maker, Writer. A graduate Electrical Engineer actively plying his expertise in the industry and at his company, Gunhead. When not designing/building, he creates a steady torrent of projects and content in the media world. Many of his projects and articles are online at element14 & SolidSmack, industry-focused work at EETimes & EDN, and offbeat articles at Make Magazine. Currently, you can find him hosting webinars and contributing to Electronic Design and Machine Design.

Cabe is an electrical engineer, design consultant and author with 25 years’ experience. His most recent book is “Essential 555 IC: Design, Configure, and Create Clever Circuits

Cabe writes the Engineering on Friday blog on Electronic Design. 

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