Stacked, Sealed Wafer Stages Used in Sylania Microcircuits

June 26, 2000
New stacked-wafer micromodule techniques have been developed by Sylvania Electric Products Co., Inc., under an independent research program. Multi-component, hermetically sealed wafers are stacked one on top of the other and interconnected by...

New stacked-wafer micromodule techniques have been developed by Sylvania Electric Products Co., Inc., under an independent research program. Multi-component, hermetically sealed wafers are stacked one on top of the other and interconnected by printed circuit wafers. Each wafer, measuring less than one-half in. sq. and about 10 mils thick, is capable of carrying a stage of circuitry.

Spacers used to separate stages are fused to the circuit wafers to provide sealing. Glass spacers are used, and the wafers are about 96% alumina ceramic. Individual modules are connected by a printed interwiring board, so that wires are not required.

A low-frequency radio transmitter is being built to illustrate the potential of the concept. Special transistors have been produced for the transmitter, and inductance will be provided by wound toroidal cores.The technique can be easily adapted to automated production, according to Sylvania. (Electronic Design, June 8, 1960, p. 5)

Among the hot topics of the first half of the '60s were miniaturization and hybrid microcircuits. At that early stage of monolithic ICs, hybrids offered many advantages over monolithics.

See associated figure

Sponsored Recommendations

TTI Transportation Resource Center

April 8, 2024
From sensors to vehicle electrification, from design to production, on-board and off-board a TTI Transportation Specialist will help you keep moving into the future. TTI has been...

Cornell Dubilier: Push EV Charging to Higher Productivity and Lower Recharge Times

April 8, 2024
Optimized for high efficiency power inverter/converter level 3 EV charging systems, CDE capacitors offer high capacitance values, low inductance (< 5 nH), high ripple current ...

TTI Hybrid & Electric Vehicles Line Card

April 8, 2024
Components for Infrastructure, Connectivity and On-board Systems TTI stocks the premier electrical components that hybrid and electric vehicle manufacturers and suppliers need...

Bourns: Automotive-Grade Components for the Rough Road Ahead

April 8, 2024
The electronics needed for transportation today is getting increasingly more demanding and sophisticated, requiring not only high quality components but those that interface well...

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!