For interconnecting high pin-count devices to boards in a solderless system, this LGA socket has 0.94-nH inductance as well as low capacitance and provides a gold-to-gold interface between the socket and substrate. Deflection is 0.012" total when fully mated with approximately 40 grams of force per contact. Mated height is 0.050" overall with contact pitch density as small as 1 mm. Although presently available as 544 pins, higher pin counts are to be available early in 1999.