Housed in the firm's SNAPHAT package, M40Z111 surface-mount device consists of a controller chip in a 28-pin, 330-mil SOIC package and a lithium cell contained in a removable top that snaps onto the SOIC after the board has been assembled, thereby preventing the cell from being exposed to high soldering temperatures. Designed to turn standard low-power SRAMs into NVRAMs, M40Z111 contains a precision voltage reference and a comparator to help write-protect the SRAM's stored data and to link the SRAM to the lithium cell during a power failure. The device is offered with a choice of 4.3V or 4.6V power fail detection voltages.
Company: STMICROELECTRONICS INC.
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