These board-stacking interconnects have a one-piece construction and 1-mm contact spacing and are available in sizes for providing board-to-board spacings of 1.65, 2.00, 5.8 and 9.9 mm. The FSI Series interfaces have beryllium-copper contacts and offer up to 50 positions per row in a dual-row design, while the SEI Series interfaces have phosphor-bronze contacts and offer single-row designs with from 5 positions. The interconnects are available with or without holddown hardware and with optional alignment pins.
Comments
Comments