The SA2443 baseband/MAC and the BGW100 RF system-in-a-package (SiP) form a IEEE 802.11b WLAN two-chip set that is said to exhibit the market's lowest standby-power consumption, smallest form factor, and the highest level of integration. In total, the baseband/MAC in an 8 mm x 8 mm package and the RF SiP in a 10 mm x 10 mm package consume 3 mW of standby power and occupy 300 mm2 of board space. In terms of integration, the SA2443 includes 1.25 Mb of SRAM, 256 Kb of ROM, a dc/dc converter, an ARM7 core processor, and optimized SDIO and SPI host interfaces. The BGW100 packs more than 50 components into a single plug-and-play package, and the entire chipset requires less than 30 external components. For further information and pricing, contact PHILIPS SEMICONDUCTORS, San Jose, CA. (408) 617-4700.
Company: PHILIPS SEMICONDUCTORS
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