Non-PCI 10/100 Ethernet Controller Integrates MAC/PHY Functions

April 2, 2001
The LAN91C111, a non-PCI 10/100-Mbit/s Ethernet controller IC, integrates the IEEE-802.3-compliant Fast Ethernet media-access controller (MAC), the Ethernet physical-layer (PHY) interface, and a transmit and receive buffer SRAM in one chip. Built by...

The LAN91C111, a non-PCI 10/100-Mbit/s Ethernet controller IC, integrates the IEEE-802.3-compliant Fast Ethernet media-access controller (MAC), the Ethernet physical-layer (PHY) interface, and a transmit and receive buffer SRAM in one chip. Built by Standard Microsystems Corp., the chip is designed to facilitate Fast Ethernet connectivity for embedded applications that use ARM, SH, PowerPC, ColdFire, 68000, and R3000 CPUs.

This chip provides a flexible slave interface for both synchronous and asynchronous data. It fits a broad range of embedded applications, such as set-top boxes, automated teller machines, switching hubs, printers, motherboards, adapter cards, security systems, network appliances, and game consoles.

Also, the LAN91C111 has a patented MMU architecture and an internal data path that's 32 bits wide. Its I/O-backed architecture dynamically and efficiently allocates buffer memory, reducing software tasks and offloading hosts. Early transmit and receive functions increase throughput. Only 16 bytes of I/O or memory address space are required.

The chip's PHY circuit contains the entire physical layer, including the coding sublayer (PCS), the physical-medium-attachment (PMA), the twisted-pair physical-medium-dependent (TP-PMD), and the autonegotiation (AUTONEG) functions. An on-chip AUTONEG algorithm lets the controller automatically configure itself for either 10- or 100-Mbit/s and half- or full-duplex operation.

Internal output waveshaping circuitry and filters eliminate the need for the external filters that are normally required in 100BaseTX and 10BaseT applications. The device supports external PHY functions through media-independent-interface (MII) pins. And, there's external PHY support for fiber and other media.

This 3.3-V integrated circuit is available in a 128-pin TQFP (NE version) at $17.65 each and in a 128-pin QFP (NC version) at $17.05 each, both in 10,000-unit orders. Samples, an evaluation board, an NDIS4 Windows 98 driver, and ETX Utility software are available now.

Standard Microsystems Corp., 80 Arkay Dr., Hauppauge, NY 11788-8847; (631) 435-6000; fax (631) 231-6004; e-mail: [email protected]; Internet: www.smsc.com.

See associated figure.

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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