Chip-Scale Package Cuts Space By 60% Versus US8

July 21, 2003

MicroPak 8, an eight-terminal chip-scale leadless package for 1-, 2-, and 3-bit logic and switch functions, offers a 60% space savings over leaded US8 packages while maintaining a 0.5-mm terminal pitch. The large 0.2- by 0.3-mm land-grid-array (LGA) contact pads ensure strong joint integrity essential for reliable operation under harsh environmental stresses, such as excessive keyboard pressure and overtemperature conditions. Available in the MicroPak 8 are members of the UHS high-performance low-voltage logic family—triple buffers, dual three—state buffers, dual gates, flip flops, and dual analog and bus switches. Later this year, a family of high-performance 1-, 2-, and 3-bit Ultra Low Power (ULP) and ULP-A logic functions, designed for 0.9- to 3.3-V operation, will be offered in the MicroPak 8 package as well. Prices start at $0.27 each in lots of 10,000 units for the devices in the UHS family.

Fairchild Semiconductor Internationalwww.fairchildsemi.com/micropak; (207) 775-8100

About the Author

Dave Bursky | Technologist

Dave Bursky, the founder of New Ideas in Communications, a publication website featuring the blog column Chipnastics – the Art and Science of Chip Design. He is also president of PRN Engineering, a technical writing and market consulting company. Prior to these organizations, he spent about a dozen years as a contributing editor to Chip Design magazine. Concurrent with Chip Design, he was also the technical editorial manager at Maxim Integrated Products, and prior to Maxim, Dave spent over 35 years working as an engineer for the U.S. Army Electronics Command and an editor with Electronic Design Magazine.