Chip-Scale Package Cuts Space By 60% Versus US8

July 21, 2003
MicroPak 8, an eight-terminal chip-scale leadless package for 1-, 2-, and 3-bit logic and switch functions, offers a 60% space savings over leaded US8 packages while maintaining a 0.5-mm terminal pitch. The large 0.2- by 0.3-mm land-grid-array (LGA)...

MicroPak 8, an eight-terminal chip-scale leadless package for 1-, 2-, and 3-bit logic and switch functions, offers a 60% space savings over leaded US8 packages while maintaining a 0.5-mm terminal pitch. The large 0.2- by 0.3-mm land-grid-array (LGA) contact pads ensure strong joint integrity essential for reliable operation under harsh environmental stresses, such as excessive keyboard pressure and overtemperature conditions. Available in the MicroPak 8 are members of the UHS high-performance low-voltage logic family—triple buffers, dual three—state buffers, dual gates, flip flops, and dual analog and bus switches. Later this year, a family of high-performance 1-, 2-, and 3-bit Ultra Low Power (ULP) and ULP-A logic functions, designed for 0.9- to 3.3-V operation, will be offered in the MicroPak 8 package as well. Prices start at $0.27 each in lots of 10,000 units for the devices in the UHS family.

Fairchild Semiconductor Internationalwww.fairchildsemi.com/micropak; (207) 775-8100

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