Packaging & Interconnects: Right-Angle Copper Connector Fits Coplanar/Perpendicular Layouts

Nov. 29, 2004

The microGiGaN FCN-268M***-G/*D high-speed surface-mount (SMT) right-angle connector suits coplanar and perpendicular board-to-board designs, in addition to 8-mm through 1-mm stacking. Measuring 5.37 mm high, it supports per-channel data rates of 622 Mbits/s to 10 Gbits/s and pc boards from 0.062 to 0.110 in. thick. It features 100-(omega) impedance matching, 3% near-end crosstalk at 50-ps risetime, a 0.5-A 30-V dc rating, and a 1-A ground rating. It comes in 12, 24, and 36 differential pairs with 0.75-(omega) signal-to-ground contact and 1.5-mm signal-to-signal pitch. SMT leads are on a 0.5-mm pitch. A unit with 12 signal pairs costs $4.15 each in 10,000-unit lots. Lead time is eight weeks.

Fujitsu Components America Inc.www.fcai.fujitsu.com; (800) 380-0059

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.