Packaging: High-Density Socket With Heatsink Targets Graphics Processors

April 28, 2005

A high-pin-count version of the Pin-Ball socket, which features a customized heatsink, is designed for high-end graphics processors. The new Pin-Ball socket has over 1400 balls and can be soldered directly to the existing footprint of a pc board. An aluminum heatsink delivers effective thermal dissipation of the excess heat generated by high-end graphics processors. The BGA/LGA socket provides 2 mm of clearance for end components, and it can be used for 0.8-, 1.0-, and 1.27-mm pitch packages up to 50 mm in any footprint configuration on any size board. In addition, the socket incorporates a spring probe technology with a spring force of 17 g at 0.25-in. deflection. Pricing for the 1400-contact Pin-Ball socket is $1500 each in single quantities. Delivery is four weeks ARO.

Aries Electronics Inc.www.arieselec.com

About the Author

David Maliniak | MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.