Light-Curable Encapsulant Boosts Production Speeds

Nov. 11, 2011
Ultra Light-Weld 9008 light-curable encapsulant promises to rapidly encapsulate and seal components in chip-on-flex or chip-on-board apps.

Ultra Light-Weld 9008 light-curable encapsulant promises to rapidly encapsulate and seal components in chip-on-flex or chip-on-board apps. It cures in seconds, is compatible with automated systems, and is resistant to humidity and thermal shock. Ultra Light-Weld 9008 forms flexible bonds to a variety of surfaces including polyimide (Kapton), glass, epoxy board, metal, and PET, and remains flexible to -40°C. DYMAX CORP., Torrington, CT. (877) 396-2988.

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