Embedded World 2026: Boards and Modules (Part 3)

A quick look at five new embedded modules that pair AI acceleration with industrial-ready connectivity and compact form factors.

April 2, 2026

3 min read

69ce712e8daebd46adc23828 Promo Ew 2026 Part 3

Here’s a look at five more modules that took the spotlight at Embedded World 2026. With an eye toward edge AI and IIoT solutions, these platforms bring a range of differentiating features to the table.

Variscite VAR-SMARC-MX8M-PLUS
congatec conga-SMX95 / aReady.COM conga-SMX95
SECO SOM-Trizeps-X-Genio360/360P
Grinn GenioSOM-360
Octavo OSD62x-PM

Variscite VAR-SMARC-MX8M-PLUS

Company: Variscite Product: VAR-SMARC-MX8M-PLUS Form factor: SMARC 2.1.1 short standard (82 × 50 mm) CPU: NXP i.MX 8M PLUS Cortex-A53 at 1.8 GHz, 800-MHz Cortex-M7 real-time co-processor NPU: AI/ML Accelerator 2.3 TOPS GPU: Vivante GC7000UL (3D) and GC520L (2D) Memory: 1- to 8-GB LPDDR4 Storage: 8- to 128-GB eMMC Communication: 2x Gigabit Ethernet, Wi-Fi 6, Bluetooth/BLE 5.4 Security: TPM 2.0 Expansion: 1x SD/MMC, PCIe Gen 3.0 Connection: 2x MIPI CSI2, MIPI-DSI, 2x CAN/CAN-FD, USB 3.0, HDMI 2.0a, 2x LVDS, 6x I2S (SAI) — Company: Variscite
Product: VAR-SMARC-MX8M-PLUS
Form factor: SMARC 2.1.1 short standard (82 × 50 mm)
CPU: NXP i.MX 8M PLUS Cortex-A53 at 1.8 GHz, 800-MHz Cortex-M7 real-time co-processor
NPU: AI/ML Accelerator 2.3 TOPS
GPU: Vivante GC7000UL (3D) and GC520L (2D)
Memory: 1- to 8-GB LPDDR4
Storage: 8- to 128-GB eMMC
Communication: 2x Gigabit Ethernet, Wi-Fi 6, Bluetooth/BLE 5.4
Security: TPM 2.0
Expansion: 1x SD/MMC, PCIe Gen 3.0
Connection: 2x MIPI CSI2, MIPI-DSI, 2x CAN/CAN-FD, USB 3.0, HDMI 2.0a, 2x LVDS, 6x I2S (SAI)

The VAR-SMARC-MX8M-PLUS is a high-performance board for edge AI use in industrial, IoT, and medical settings. It’s one of the first capable of complex machine learning, such as object recognition, thanks to its TOPS 2.3 NPU.

Variscite believes this module serves as the standard for smart vision and industrial automation via pin-to-pin scalability. In addition, the company made the VAR-SMARC-MX8M-PLUS future-proof as it has a TMP 2.0 security chip, dual Gigabit Ethernet, and Wi-Fi 6. Developers can seamlessly advance their projects from prototypes to an industrial rollout without interruptions.

congatec conga-SMX95 / aReady.COM conga-SMX95

Company: congatec Product: Conga-SMX95/aReady.COM conga-SMX95 Form factor: SMARC 2.1.1 82 × 50 mm CPU: NXP i.MX 95 (up to 6-core Arm Cortex-A55) NPU: Integrated eIQ Neutron NPU (Up to 2 TOPS) GPU: Arm Mali-G310 3D GPU Memory: 16-GB-max LPDDR5 (6,400 MT/s) with inline ECC Storage: 256-GB-max eMMC 5.1 Communication: 2x Gigabit Ethernet (TSN), Optional Wi-Fi 6/BT 5.3 Expansion: 2x PCIe Gen 3.0, 1x SDIO Connection: 2x USB 3.0, 2x USB 2.0, 2x CAN-FD, 2x MIPI-CSI, HDMI 2.0a, optional DisplayPort 1.4, LVDS, 14x GPIOs — Company: congatec
Product: Conga-SMX95/aReady.COM conga-SMX95
Form factor: SMARC 2.1.1 82 × 50 mm
CPU: NXP i.MX 95 (up to 6-core Arm Cortex-A55)
NPU: Integrated eIQ Neutron NPU (Up to 2 TOPS)
GPU: Arm Mali-G310 3D GPU
Memory: 16-GB-max LPDDR5 (6,400 MT/s) with inline ECC
Storage: 256-GB-max eMMC 5.1
Communication: 2x Gigabit Ethernet (TSN), Optional Wi-Fi 6/BT 5.3
Expansion: 2x PCIe Gen 3.0, 1x SDIO
Connection: 2x USB 3.0, 2x USB 2.0, 2x CAN-FD, 2x MIPI-CSI, HDMI 2.0a, optional DisplayPort 1.4, LVDS, 14x GPIOs

The Conga-SMX95/aReady.COM conga-SMX95 from congatec is a high-performance module that focuses on application-ready hardware. While it comes with the NXP i.MX 95 CPU, 2 TOPS eIQ Neutron NPU and LPDDR5 memory, the advantage lies in the aREADY.COM ecosystem integration. A secure OS, software stacks, and a hypervisor enable quicker development cycles.

According to congatec, this module can reduce the time-to-market, especially for medical and industrial settings relying on security. Engineers won’t have to focus on low-level driver debugging for weeks. Instead, they can work on unique AI and edge computing.

SECO SOM-Trizeps-X-Genio360/360P

Company: SECO Product: SOM-Trizeps-X-Genio360/360P Form factor: SODIMM-220 67.6 × 36.7 × 6.4 mm CPU: MediaTek Genio 360 (1 A76 + 5x A55) Or Genio 360P (2x A76 + 6x A55) NPU: MediaTek 8th-Gen (5.1 TOPS on 360/Up to 8+ TOPS on 360P) GPU: Arm Mali-G57 GPU Memory: 1-GB/2-GB and 4-GB LPDDR4X/LPDDR4-3733 (soldered) Storage: eMMC 5.1 up to 64 GB Communication: 1x GB Ethernet Mac/PHY, Wi-Fi/BT (Optional) Expansion: 1x SDIO Security: TPM 2.0 (Optional) Connection: 1x USB 3.2, 1x USB 2.0, 1x CAN-FD, 1x PCIe Gen 2, 2x MIPI-CSI, MIPI-DSI, LVDS, DPI 4, or eDPI 3 — Company: SECO
Product: SOM-Trizeps-X-Genio360/360P
Form factor: SODIMM-220 67.6 × 36.7 × 6.4 mm
CPU: MediaTek Genio 360 (1 A76 + 5x A55) Or Genio 360P (2x A76 + 6x A55)
NPU: MediaTek 8th-Gen (5.1 TOPS on 360/Up to 8+ TOPS on 360P)
GPU: Arm Mali-G57 GPU
Memory: 1-GB/2-GB and 4-GB LPDDR4X/LPDDR4-3733 (soldered)
Storage: eMMC 5.1 up to 64 GB
Communication: 1x GB Ethernet Mac/PHY, Wi-Fi/BT (Optional)
Expansion: 1x SDIO
Security: TPM 2.0 (Optional)
Connection: 1x USB 3.2, 1x USB 2.0, 1x CAN-FD, 1x PCIe Gen 2, 2x MIPI-CSI, MIPI-DSI, LVDS, DPI 4, or eDPI 3

The SECO SOM-Trizeps-X-Genio360/360P is a powerful module for high-performance edge AI and multimedia purposes. Manufacturers are able to upgrade it down the line according to performance needs, as the module uses an industry-standard SODIMM-200 connector. Developers can leverage the 5.1-TOPS Genio 360 and 8+-TOPS Genio 360P to elevate their system’s AI capabilities.

SECO said this module is well-suited for industrial HMI and smart retail, as 4K60 video output and DisplayPort 1.4 fit that purpose for industrial reliability.

Grinn GenioSOM-360

Company: Grinn Product: GenioSOM-360 Form factor: 30- × 30-mm LGA303 Package CPU: MediaTek Genio 360 Processor (Octa-core: 2x Cortex-A76 + 6x Cortex-A55) NPU: MediaTek 8th-Gen AI Accelerator GPU: Arm Mali-G57 MC2 GPU Memory: LPDDR4X-3733 8 GB Max Storage: eMMC 5.1 16 GB up to 64 GB Communication: 1x GB Ethernet MAC, Wi-Fi/BT (Optional) Expansion: 1x PCIe Gen 2 Connection: 1x CAN-FD, 1x USB 3.0, 2x USB 2.0, RGMI, 2x MIPI-CSI, MIPI-DSI, LVDS, eDP, DP 1.4/eDM 1.2 — Company: Grinn
Product: GenioSOM-360
Form factor: 30- × 30-mm LGA303 Package
CPU: MediaTek Genio 360 Processor (Octa-core: 2x Cortex-A76 + 6x Cortex-A55)
NPU: MediaTek 8th-Gen AI Accelerator
GPU: Arm Mali-G57 MC2 GPU
Memory: LPDDR4X-3733 8 GB Max
Storage: eMMC 5.1 16 GB up to 64 GB
Communication: 1x GB Ethernet MAC, Wi-Fi/BT (Optional)
Expansion: 1x PCIe Gen 2
Connection: 1x CAN-FD, 1x USB 3.0, 2x USB 2.0, RGMI, 2x MIPI-CSI, MIPI-DSI, LVDS, eDP, DP 1.4/eDM 1.2

GenioSOM-360 is a small module featuring MediaTek’s GenioSOM-360 processor. With a 30- × 30-mm form factor, Grinn’s module is designed for physical AI applications running on Cortex-A76 cores and a 7.4-TOPS NPU. The vibration-resistant board serves as a middle ground for low-power IoT and high-end computing.

The company also developed it to last 10 years and run small generative edge-AI models. The GenioSOM-360 module can be deployed in commercial and industrial settings that require small hardware.

Octavo OSD62x-PM

Company: Octavo Systems Product: OSD62x-PM Form factor: 9- × 14-mm BGA Package CPU: Texas Instruments AM62 GPU: OpenGL ES 3.1, Vulkan 1.2 (3D Graphics up to 1080p60) Memory: 1- to 2-GB DDR4 Storage: 1x eMMC, 2x SDIO, 1x GPMC Communication: Gigabit Ethernet Switch, TSN support Connections: 2x USB 2.0, 3x CAN-FD, MIPI CSI 1.3, MIPI-DPHY 1.2, OLDI/LVDS, 24-bit RGB — Company: Octavo Systems
Product: OSD62x-PM
Form factor: 9- × 14-mm BGA Package
CPU: Texas Instruments AM62
GPU: OpenGL ES 3.1, Vulkan 1.2 (3D Graphics up to 1080p60)
Memory: 1- to 2-GB DDR4
Storage: 1x eMMC, 2x SDIO, 1x GPMC
Communication: Gigabit Ethernet Switch, TSN support
Connections: 2x USB 2.0, 3x CAN-FD, MIPI CSI 1.3, MIPI-DPHY 1.2, OLDI/LVDS, 24-bit RGB

Octavo Systems’ OSD62x-PM is an extremely small module, approximately the same size as a postage stamp. Engineers can use it to design and develop extremely compact, custom industrial equipment without complex high-speed DDR routing. Octavo refers to this board as a game-changer for industrial IoT and robotics, where space is limited. It’s also highly reliable with features like TSN Ethernet and dual 1080p display support, suiting it for rugged applications.