This video appeared in Microwaves & RF and has been published here with permission.
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At TDK's CES 2023 booth, Tony Ochoa, product marketing manager for the company's μPOL dc-dc power modules, explains how these modules can help designers with powering of CPUs, MCUs, ASICs, FPGAs, DSPs, and other advanced digital-logic devices. Such devices impose board-level power challenges through very high performance, fast load transients, and the need for precise voltage accuracy. Moreover, today's design paradigms include shrinking PCBs, making it even more challenging to design in sufficient power supplies for digital devices.
TDK's μPOL technology encompasses an integrated solution that includes a power semiconductor and inductor in a very compact package. Output voltages from these wide-input-range , non-isolated step-down converters can be configured from 0.6 to 5 V using serial communication (I2C) with no need for any external components, making them very versatile devices.
The converter's stability is ensured internally, thus no need for external compensation. Lots of design efforts have been madeto make this device easy to use. System designers need only add input and output capacitors to have a complete dc-dc converter.
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