Eliyan's mission is to revolutionize chiplet connectivity technologies by challenging the status quo to unleash the ultimate performance of smart systems of the future.
Eliyan’s PHY technology, NuLink, enables the creation of super large SiPs on Standard Packaging, thus improving AI performance 10X by eliminating The Memory Wall.
NuLink PHY technology can be optimized for high-speed serial die-to-die connections using any industry standard or custom interconnect scheme. It can deliver outstanding performance at low power in advanced packaging or standard packaging using a wide range of bump pitches.
JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.
Discover how the Universal Memory Interface tackles substrate- and die-level real-estate challenges in chiplet-based design, unlocking performance and scalability.
