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What’s the Difference Between Immersion and Direct-to-Chip Liquid Cooling? (Download)

Feb. 6, 2025
Log in to download the PDF of this article on liquid-cooling solutions for ever-more-powerful data centers.

Read this article online.

A massive shift is taking place in today’s data centers as rack power consumption skyrockets to levels never thought possible. Driven by the emergence of compute-intensive artificial-intelligence (AI) and high-performance computing (HPC) applications, data centers have quickly transitioned from needing to cool 10- to 20-kW racks with air-cooling strategies to cooling 120-kW racks powered by NVIDIA’s Grace Blackwell superchip—and that’s just for one rack! 

Air-cooling methods don’t stand a chance of cooling this amount of heat, and, as a result, has paved the way for novel liquid-cooling technologies that fall into one of two categories: “direct-to-chip” or “immersive.” Unlike traditional air-based approaches, these technologies use liquid, either water or dielectric fluid, to remove heat from the equipment. 

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