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One of the primary challenges facing semiconductor manufacturers is that the devices requiring the most extensive testing are often the most expensive to test. AI accelerators, high-performance-computing (HPC) and server processors, networking ASICs, and advanced chiplet-based devices frequently require lengthy test sequences, some of which can extend from 30 minutes to more than two hours per device.

Traditional test insertions such as wafer sort and final test typically emphasize throughput. System-level test (SLT), however, must balance throughput with realistic workload execution, environmental stress, and application-level validation. This changes the economics of manufacturing test.