RF Test Socket Has Built-In Spring-Loaded Heatsink

March 6, 2000
Designed for use with QFP, LCC, and SO devices, a new RF test socket provides a built-in spring-loaded heatsink to prevent deformation of device leads during testing cycles. Its heatsink is constructed from copper or aluminum, with gold or silver...

Designed for use with QFP, LCC, and SO devices, a new RF test socket provides a built-in spring-loaded heatsink to prevent deformation of device leads during testing cycles. Its heatsink is constructed from copper or aluminum, with gold or silver plating. At the same time, the spring-loading provides the heatsink with compliancy so it maintains constant contact with the device's heat pad. The heatsink can be coupled with pogo pins for better electrical contact, or with a thermocouple for direct thermal monitoring of the test package. The entire socket assembly is pressure-mounted to the load board. And, the socket incorporates the company's patented Microstrip Contacts, which have been shown to have less than 1-dB loss at 10 GHz, with no more than 0.01-nH measured self-inductance. Pricing begins at $3801 each for 48 leads or less, depending on heatsink specifications. Pricing for two or more units begins at $2770 each. Delivery is six weeks ARO.

Aries Electronics Inc., P.O. Box 130, Frenchtown, NJ 08825; (908) 996-6841; fax (908) 996-3891; [email protected]; www.arieselec.com.

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