Development Platform Rockets 3G Base Stations

Feb. 1, 2007
Allowing users to jumpstart software programming and facilitate early prototyping, the company has achieved full interoperability between its pre-processing switch (PPS) and the highest performance DSPs from Texas Instruments. The result of this

Allowing users to jumpstart software programming and facilitate early prototyping, the company has achieved full interoperability between its pre-processing switch (PPS) and the highest performance DSPs from Texas Instruments. The result of this collaboration is a robust 3G base station development platform that narrows time to market. The AMC70K2000 development platform integrates the PPS with four fabric-connected DSPs (TMS320C6455/6482) on an advanced mezzanine card (AMC). The AMC includes a 3-Gb Ethernet backplane, one I/O line, up to 128 MB of DDR2 DRAM per DSP, flash memory, I2C interface, JTAG for a system boot master, MMC control for IPMI with additional applications, and a local-power option for stand-alone operation. An expansion port accepts a daughter card supporting other Serial RapidIO endpoints. Single-unit price for the platform is $5,995. INTEGRATED DEVICE TECHNOLOGY INC., Santa Clara, CA. (800) 345-7015.

Company: INTEGRATED DEVICE TECHNOLOGY INC.

Product URL: Click here for more information

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