EE Product News

Open-Fin IC Cooler Sports Fan-To-Sink Design

Promising high levels of performance in a compact package, the V6X090 open-fin IC cooler measures in at 70 mm x 58 mm x12 mm and employs a unique embedded fan-to-sink design that reduces IC installation steps. The open-finned design combines both natural and forced air convection while employing a pre-applied phase change pad and universal mounts. With a life expectancy of 50,000 hours, the component is suitable for use with BGA packages, graphic and embedded processors, microprocessors, FPGAs, and DSPs. For more information, call Dennis Eisen at JARO COMPONENTS INC., Boca Raton, FL. (561) 241-6700.


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TAGS: Digital ICs
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