EE Product News

Encapsulant Withstands Solder Reflow Conditions

Capable of withstanding 260ûC peak solder reflow conditions while meeting JEDED Level-3 standards, Hysol FP4453 dam-and-fill encapsulant is a black, high-viscosity liquid that provides minimum flow characteristics. In contrast, Hysol FP4450NL is a high-flow, self-leveling material that flows quickly. Both encapsulants can be used onno-lead assembly lines and can withstand a cycling temperature range of from-65ûC to 125ûC.


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TAGS: Components
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