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Lead-Free Solder Paste Addresses Fine-Pitch Applications

Molded for lead-free process requirements, Multicore LF328 is a halide-free, no-clean, lead-free solder paste suitable for high-volume, stencil-printing applications with chip-scale-package lead pitches of 0.5 mm and 0.4 mm. Differing from similar products, LF328 exhibits low voiding in BGA joints. The material also provides the tack force necessary to resist component movement during high-speed placement, allowing for a fast print speed with low print pressure while increasing resistance to humidity. Additionally, it bonds to a wide range of surface finishes, including Ni/Au, immersion Sn, immersion Ag, and OSP copper, and meets ROL0 to ANSI/J-STD-004 requirements. HENKEL LOCTITE CORP., Rocky Hill, CT. (800) 562-8483.


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TAGS: Components
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