Electronic Design

Phase-Change Material Provides Low Thermal-Resistance Interface Path

Thermflow T766 is a phase-change material that provides a low thermal-resistance interface path between hot components and heatsinks. It also enables the easy removal of sinks for rework applications. The pads include a foil layer that allows heatsinks to be removed without force and without leaving residue to be cleaned from component surfaces.

This material consists of a tacky, electrically nonconductive phase-change film on one side of a highly conformable metal foil. The material features a low thermal impedance of 0.04°C-in.2/W. The solid film softens at component operating temperatures to fill air gaps and enhance the performance of heatsinks and spreaders. Attaching securely onto heatsinks or spreaders, the film is protected by the foil layer during assembly. This allows the pad to conform to mounting surfaces on thermal modules in laptop computers, on microprocessors in PCs, workstations, and servers, and on BGA packages. Since there is no need for protective liners, assembly is simplified.

Standard square pad sizes are 17.8, 25.4, and 31.8 mm. Custom shapes are also available. Pricing starts at less than $0.08/pad in large volumes.

(781) 935-4850; www.chromerics.com

TAGS: Components
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