Packaging/Interconnects: 10U 21-Slot VME64 Extensions System Comes Full-Featured

April 12, 2004

A full-featured transition card-ready thermally managed system integrates a 21-slot VME64 extensions backplane with P0 connectors. It features a shielded electromagnetic-compatibility 9-in. subrack that can accommodate up to 21 6U by 16-mm deep boards and 21 rear, 6U by 80-mm deep transition cards with clips installed in each card guide. It also features a wide-range input, power-factor correction, and a 1-kW four-output power supply (3.3 V @ 60 A, 5 V @ 120 A, 12 V @ 17 A, and −12 V @ 17 A). The chassis, VITA-1-1994 backplane, and power supply are fully assembled and wired. Dimensions are 10U high by 84 HP wide by 456.5 mm deep. Cost is $3000, with deilvery from stock.

Schroff Productswww.schroff.us (401) 732-3770

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.