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Thermal Interface Materials: Cool Options for Better Power Density (Download)

Oct. 17, 2022

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One of the most important—and difficult—design decisions for circuit designers is creating an optimum heatsink method for high-power devices/systems such as power processors and power supplies. A key area of expertise is the attachment method of an electronic power device to a heatsink or a heat spreader. As power densities increase in power electronics, the thermal interface in between the power module/device and heatsink is now a bigger challenge for designers.

The bottom line is to have a solid thermal contact that will direct most of the heat away from the electronic power devices and on through a heatsink.


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