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cPCI Enclosures Eliminate Cooling Dead Spots

The SRME Series CompactPCI enclosures employ patented air deflecting CoolSlot card guides, which are said to solve overheating problems by eliminating cooling dead spots on boards while providing uniform airflow throughout the system. Thermal simulation of the enclosures exhibit an average airflow of 200 LFM to 285 LFM throughout the front card slots of the enclosure.The enclosures are available in 2U four-slot and 3U six-slot versions housing the companyÕs VME64x or VME backplanes. They are wired for one, two, or three 3U, hot-swap power supplies and a hot-swap fan tray with two to three fans. Other features include IEEE 1101.10/11 compatibility, provisions for 80 mm rear plug-in and transition modules, front and rear ground clips, ac or dc power input, and optional 6U peripheral shuttles including hot-swap SCSI SCA disk-drive shuttles with auto termination. Custom configurations are available. Pricing starts at $1,695 with delivery from two to six weeks ARO. HYBRICON, CORP. Ayer, MA. (877) 492-74266


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