EE Product News

Interconnect System Addresses Board Stacking Requirements

Broaching the stacking requirements of high-speed boards, the RISE-UP interconnect system employs a controlled-impedance pc board with an embedded ground plane to improve performance over traditional connector sets. The system is capable of transmitting data at rates in excess of 6.25 Gb/s and operates at up to 3.5 GHz per differential pair in 25-mm board stacking applications. The HSEC8 and MEC8 series accommodate parallel-board stacking, perpendicular daughtercard configurations, and horizontal or coplanar applications. Standard systems include single-ended with 50 or 70 I/Os and differential pair with 33 or 46 I/O pairs, both with a 25-mm stack height. Pricing begins at $0.15 per mated line. SAMTEC INC., New Albany, IN. (800) 726-8329.

Company: SAMTEC INC.

Product URL: Click here for more information

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