EE Product News

Interconnects Enable High Density Board Stacking

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SamArray interconnects are said to provide high density, high speed and high reliability with standard board-to-board interconnects. The 4.15 mm profile system is designed for the OC-192 transponder MSA. The YFS, YFT and YFW series .050" pitch interfaces are available with up to 500 I/Os. At 100 ps rise time, the maximum differential impedance mismatch is 3%, and the maximum near end cross talk is .05% -3.5%. The system performs up to 10 GHz. The YFS socket features the four-finger Tiger Eye contact. Standard board-to-board spaces are 4.15 mm, 5 mm, 7 mm, 9 mm and 12 mm, with 19 mm and 25 mm systems in design. The interfaces are surface mounted and processed with standard BGA processing techniques. Pricing for the SamArray interfaces begins at $0.10 cents per mated line. SAMTEC, INC., New Albany, IN. (800) 726-8329.

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