EE Product News

Interconnects Link Boards In High-End Apps

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Sporting 200 contacts on 0.8 mm centers, this board-to-board, straight surface-mount plug-and-socket interconnect system has been developed for use in supercomputers, telecomm switching systems, test equipment, and other high-end applications. The interconnect system is parallel mounted, offers a low, 5.0-mm board stacking height, and has snap-in connections and polarized, BeCu alloy contacts having a bellows design and a high insertion/withdrawal rate. The interconnects also feature a 1.5-mm gap between contacts that forgives mismatches and warped pc boards.

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