Aimed at high-density embedded applications, the WED3C741016M-400BX multi-chip package combines a 400-MHz PowerPC 7410 AltiVec RISC processor with 2 MB of SSRAM configured as L2 cache. Housed on a single interposer, the combo promises up to 60% board-space savings compared to discrete techniques. The package is flip-chip attached on a ceramic, 255 CBGA package measuring 21 mm x 25 mm x 1,329 mm2. Other features include support for power-management functions such as doze, nap, sleep, and dynamic power management, low inductance, reduced I/O count (255 as opposed to 560), and reduced part count. With a lead-time from 18 to 20 weeks, pricing is under $1,000 each/1,000. WHITE ELECTRONIC DESIGNS CORP., Phoenix, AZ. (602) 437-1520.