January 20, 2025 - Electronic Design Today

Vibration and thermal signatures are crucial toward gaining a deeper understanding of failure modes in process operations and thus are an enabler of a predictive-maintenance strategy...

InductEV and Skien Norway's ENRX have signed an MOU that seeks to establish technical standards and ensure compatibility across the wireless EV charging ecosystem worldwide.

Get up close and personal with some of the world’s most interesting insects and the micro worlds they call home in Nat Geo’s latest series, “A Real Bug’s Life Season 2.”

Infineon’s full/half-bridge driver ICs are qualified for automotive applications, feature a wide temperature range, and have Arduino Uno evaluation shields available.

Additive manufactured electronics is grabbing the attention of the electronics industry. Nano Dimension’s Zvika Avlon discusses how and why this technology is shaking things up...

This inexpensive, water-powered non-electronic bandage creates an electric field to promote healing in chronic wounds.

Whether you’re a book-learned engineer looking to finally get your hands on building circuits, or a maker, hobbyist, or student, these instructional videos get you started.

EMI can be a pesky nuisance, and even disastrous, in outer space travel. NASA endeavors to lower electromagnetic interference through various testing procedures.

Diodes Inc.’s AEC-Q100-qualified automotive, 26-V, 400-kHz bandwidth uni/bidirectional, low- and high-side current monitors come in SOT25/SOT26 packages.

Unlocking the future of analog design, AI-driven verification accelerates innovation by breaking through traditional SPICE bottlenecks, ensuring faster, more accurate results....

Delivering 300 V at modest current requires a different type of IC. Apex’s new multichannel driver fits that bill.

Teledyne FLIR, in collaboration with VSI Labs, released its testing plan methodology and the results of its FMVSS standard No. 127 pedestrian automatic emergency braking (PAEB...

A flyback-based switching architecture enables USB-C chargers to generate up to 240 W from a single 1C port.

Part 2 describes TIA applications in fiber-optic communication systems and makes recommendations for designs that are specific to each application in fiber-optic comms.

Part 1 of this two-part series introduces transimpedance amplifiers and describes their application in laser rangefinders and LiDAR systems.