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The automotive industry is undergoing an exciting transformation in connectivity as the need for higher speed and for more compute power is changing the game. Changes, updates and improvements are occurring nearly every day, with automakers in a race to deliver the latest safety and communication features and optimal functionality to consumers. These trends are only accelerating and the car of the (near) future will be more connected than ever before. This is creating a tremendous demand for both processing power and the ability to transmit vast amounts of high-speed data in new automotive designs.
The design challenges go well beyond simply delivering processing power and high-speed data transfer. Design engineers must also safely manage heat generated by those processes in the confines of tight vehicle packaging requirements, as well as ambient temperature fluctuations, while adhering to stringent safety and reliability standards of the automotive industry.