EE Product News

High-Frequency Multi-Layer Chip Inductors Suit RF/Wireless Apps

A new line of miniature high-frequency, multi-layer chip inductors targeted at RF and wireless applications has been introduced. The devices are offered in 0603 and 0805 sizes and are made using high-Q ceramic material for what's claimed as exceptional RF performance and self resonant frequencies up to 17 GHz. The components are said to be ideal for use in PCS/cellular amplifier modules, wireless LANs, and many other RF applications.


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TAGS: Components
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