IGBT Power Modules Geared for Air Conditioners, Heat Pumps, Home Appliances
Small low-loss intelligent molded modules (SLLIMMs) with direct-bonded copper (DBC), developed by STMicroelectronics, come in a new compact outline for industrial drives, air conditioners, heat pumps, and home appliances. The space-saving modules deliver a complete 600-V, three-phase IGBT inverter bridge with an 18.8- × 32.8-mm footprint, which is more than 30% smaller than existing IGBT IPM in DBC packages.
The first module in the new SLLIMM Compact series, the 20-A STGI15C60S, targets low- and medium-power motor-drive designs. The thermally efficient package with topside cooling ensures superior reliability in hard-switching circuit topologies operating at up to 20 kHz. As part of the STPOWER portfolio, the module contains two control ICs for driving the integrated high- and low-side IGBTs, as well as a bootstrap diode and protection circuitry.
The IGBTs leverage ST’s trench-gate and short-circuit rugged technology with very fast soft-recovery freewheeling diodes, combining low saturation voltage with stable dynamic performance for enhanced energy efficiency. High-side reference outputs arranged on the signal side of the dual-inline package help to simplify the bootstrap circuit layout.
While the driver design and IGBTs are optimized for low EMI, the package is fully isolated for safety with an isolation rating of 2,000 V RMS/min. Protection includes undervoltage lockout (UVLO) and smart shutdown that prevents operation in unsafe conditions or when a fault is detected. There’s also a temperature sensor and a comparator that designers can use to indicate any fault measurable as a voltage signal.
The STGI15C60S is in production now, in a CDIPB-26L DBC package, priced from $4.35 for orders of 1,000 pieces.
About the Author
Lee GoldbergLee Goldberg
Contributing Editor
Lee is the author of the popular PowerBites series.
Lee Goldberg is a self-identified “Recovering Engineer,” Maker/Hacker, Green-Tech Maven, Aviator, Gadfly, and Geek Dad. He spent the first 18 years of his career helping design microprocessors, embedded systems, renewable energy applications, and the occasional interplanetary spacecraft. After trading his ‘scope and soldering iron for a keyboard and a second career as a tech journalist, he’s spent the next two decades at several print and online engineering publications.
Lee’s current focus is power electronics, especially the technologies involved with energy efficiency, energy management, and renewable energy. This dovetails with his coverage of sustainable technologies and various environmental and social issues within the engineering community that he began in 1996. Lee also covers 3D printers, open-source hardware, and other Maker/Hacker technologies.
Lee holds a BSEE in Electrical Engineering from Thomas Edison College, and participated in a colloquium on technology, society, and the environment at Goddard College’s Institute for Social Ecology. His book, “Green Electronics/Green Bottom Line - A Commonsense Guide To Environmentally Responsible Engineering and Management,” was published by Newnes Press.
Lee, his wife Catherine, and his daughter Anwyn currently reside in the outskirts of Princeton N.J., where they masquerade as a typical suburban family.
