TechXchange: Delving into Chip Packaging

Taking a close look at chip packaging technology including new advances such as chiplets.
Related To: 
Nov. 6, 2024
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6914b23258aebfda53b0a723 Chip Packaging Promo

This TechXchange examines chip packaging technology including new advances such as chiplets. Check out the video series on chip packaging.

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We’ve come a very long way from the first IC, but we still have a long way yet to go to achieve the full promise of the IC revolution.
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High-density BGAs and 3D stacking increase compute and storage density.

Chip Packaging Video Series

Dr. Navid Asadi’s group provides an introduction to conventional chip packaging methods in this first of a mutlipart series on chip packaging technologies.

Chip Packaging Part1 Promo
Dr. Navid Asadi’s group provides an introduction to conventional chip packaging methods
Chip Packaging Part2 Promo
Dr. Navid Asadi’s group delves into chip packaging methods including system-in-package (SIP)
Chip Packaging Part3 Promo
Dr. Navid Asadi’s group examines how silicon interposers are changing chip packaging
Chip Packaging Part4 Promo
Dr. Navid Asadi’s group examines 2.5D and 3D packaging for expanding capabilities and capacities of chip solutions
Chip Packaging Part5 Promo
Dr. Navid Asadi’s group examines chip package production
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Dr. Navid Asadi’s group delves into wafer scale and panel level chip packaging.

About the Author

William G. Wong
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William G. Wong

Senior Content Director - Electronic Design and Microwaves & RF

I am Editor of Electronic Design focusing on embedded, software, and systems. As Senior Content Director, I also manage Microwaves & RF and I work with a great team of editors to provide engineers, programmers, developers and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our template and send to me along with a signed release form. 

Check out my blog, AltEmbedded on Electronic Design, as well as his latest articles on this site that are listed below. 

You can visit my social media via these links:

I earned a Bachelor of Electrical Engineering at the Georgia Institute of Technology and a Masters in Computer Science from Rutgers University. I still do a bit of programming using everything from C and C++ to Rust and Ada/SPARK. I do a bit of PHP programming for Drupal websites. I have posted a few Drupal modules.  

I still get a hand on software and electronic hardware. Some of this can be found on our Kit Close-Up video series. You can also see me on many of our TechXchange Talk videos. I am interested in a range of projects from robotics to artificial intelligence. 

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