Master Bond UV26DCMed is a dual-cure epoxy system designed for medical applications. It utilizes UV light for the initial cure and heat to fully polymerize areas not directly ...
Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room ...
The selection process of an adhesive, coating or potting compound can pose a few challenges for engineers. Some of these include adhesion, temperature and thermal cycling resistance...
For over 40 years, Master Bond has been custom formulating advanced adhesive, sealing, coating, potting and encapsulation compounds for high tech industries. We offer unmatched...
With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound...
Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. This NASA low outgassing approved system cures at the low temperature of 80˚C and...
Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding and sealing. Key Features Thermal conductivity exceeds 6...
Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest...
Master Bond EP30HT-LO is a moderate-viscosity, two-component, epoxy system that can be cured at room temperature, or at elevated temperatures for a faster cure. It can bond to...
Master Bond UV10TKLO-2 is a one-component UV-curable system for high-performance bonding, sealing, and encapsulation applications. It meets NASA’s specifications (ASTM ...