December 9, 2024 - Electronic Design Today

After a brief review of the history of the K2-W vacuum-tube op amp, an LTspice model is used to create its schematic in preparation for SPICE simulation.

Learn how modern snubber circuits are mitigating the challenges posed by advanced semiconductor technologies in power electronics.

ROHM’s automotive-grade SiC Schottky diodes feature new packaging that make them more resistant to creepage-induced leakage.

By integrating Linux Foundation Energy’s open-source EV charger technology, Irdeto and ChargeHub provide Plug & Charge at more than 120,000 North American charging ports.

Takashi Yogi offers practical insights on circuit design, real-life problem-solving, and tips for mastering electronics through hands-on experience and self-study.

Microchip's latest integrated IGBT-based devices feature improved packaging, lower on-state voltage, and other properties to address the needs of myriad power applications.

The Treo Platform features a modular architecture to accelerate development of intelligent power management, sensor interface, and communications solutions.

This ultrawideband link aggregates and synchronizes multiple parallel channels for ultrafast capability.

Stellantis and Factorial unveiled the next chapter in their partnership with the latter’s solid-state battery technology, which offers over 390Wh/kg energy density. It will debut...

Make gift-giving a breeze with these gift ideas for that engineer, kid, Maker, electronics hobbyist, or geek who seems to have everything—including socks and sweaters.

Non-volatile technologies like MRAM and particularly ReRAM are poised to finally take a major leap into the embedded-memory design space.

From TechXchanges to Quick Polls, Electronic Design goes all digital all the time.

Semiconductor quantity and functionality in cars continues to grow. As each type of device poses unique test challenges, a one-size-fits-all test approach won’t suffice. A test...

This TechXchange looks at RISC-V chips, boards and modules.