Use of electrically conductive gaskets with ENIG plated circuit boards has prompted questions from design and application engineers about corrosion that may occur when these gaskets...

Silicones have an attractive balance of properties, support high-volume manufacturing, and enable high-speed connections. They offer solutions to challenges with adhesion, encapsulation...

With the proliferation of business-critical control equipment on the plant and factory floor, many supervisors need scalable, configurable housing for their sensitive electronics...

Today’s electronic equipment must be designed to, first, operate in the electromagnetic (EM) environment it is to be employed in, and second, ensure that the EM fields generated...

This article helps clear up misunderstandings and misconceptions surrounding the high-performance MicroTCA backplane-based embedded architecture.

Mid-board copper solutions overcome PCB layout restrictions and add design flexibility.

Electrically conductive form-in-place (FIP) gaskets are used as part of a flexible EMI gasketing solution for a wide range of electronic products. Many applications involve complex...