Mar. 25, 2024 - Electronic Design Today

Developed by Texas Instruments, this IC initiates battery cutoff via a pyro, non-thermal fusing device.

This edition of PowerBites brings you new developments in hybrid-electric aircraft and a V2G standard, MOSFET moves, silicon and SiC advances, plus more.

The latest Blackwell GPU is the result of innovations in everything from the transistors themselves to the architecture, advanced packaging, connectivity, and memory.

When it comes to chiplets, it’s all about packaging technology.

Several hybrid-electric aircraft are nearing commercial production, perhaps changing the economics of regional, short-haul, and air taxi services. Here's a look at what makes ...

TI leverages its integrated transformer technology in its latest isolated DC-DC power module, which is claimed to be close to 90% more compact than comparable solutions.

Part 2 compares the characteristics of linear and multichannel receiver devices, examining resolution capabilities and sensitivity to impulse noise as well as the relationships...

Infineon’s new series of solid-state isolators facilitate faster and more reliable switching in high-voltage electronics.

Stellantis’s (Chrysler) first BEV vehicle, scheduled as a 2025 model, will be built on the STLA Large platform, which targets a 500-mile EV range. Fast charging will add up to...

Teledyne LeCroy is upgrading its CrossSync PHY technology, which connects oscilloscopes to protocol analyzers in real-time, for the PCIe Gen 6 standard.

Power-hungry AI accelerators and other high-performance chips are throwing a wrench into power integrity. Learn how Picotest is trying to tackle the challenges with more advanced...