October 14, 2024 - Electronic Design Today

The EiceDRIVER 1EDL8011 high-side driver rapidly cuts power to battery-powered devices for system protection in the event of a fault.

This IPD has a smaller package, more power, and smarter performance for BLDC motor drivers—what’s not to like?

ROHM’s new AEC-Q101-qualified MOSFETs are capable of high-speed switching with low on-resistance to minimize loss and heat generation in automotive applications.

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics.

Learn to measure electromagnetic emissions in integrated circuits caused by EMI disruptions, as well as the effect of power-supply interference on immunity and emissions.

Georgia Tech’s ECE undergrads design custom mixed-signal ASICs that are then fabricated by Texas Instruments on 300-mm wafers and returned for testing.

Sateliot’s mission is to provide extended 5G coverage to mobile telecom operators around the globe, including remote areas.

AI integration within robots changes everything about workflows, but it requires workforce retraining to mitigate job replacements.

Additive manufacturing (AM), otherwise known as 3D printing, is an incredible process that creates three-dimensional, physical objects via a computer design file.