Engineering is making the car of the future possible by enabling electric vehicles, self-driving, telematics, cellular V2X, ADAS, DSRC, and more via innovations in power, embedded design, communications, and other technology areas.
The UF3C120150K4S combines a high-voltage SiC JFET and low-voltage silicon MOSFET for gate-drive compatibility, while its 4-terminal TO-247 package with Kelvin connections enhances dynamic performance.
Automotive electronics, particularly in autonomous vehicles, is skyrocketing, and advanced secure memory storage in non-volatile memory will be crucial to next-gen computing architectures for these applications.
Powertrain electrification, automation, and new business models are shaping the next generation of mobility. These trends will profoundly impact the electrical power and electronic architectures of future vehicles.