Electronic Design's Lee Goldberg chronicles a year of remarkable advances in power, power-conversion and power-management ICs, and packaging technology with a baker’s dozen of...
Innovations in cool-running packaging technologies and embedded passive networks are enabling power devices to run at higher power densities and frequencies.
Higher levels of integration and ingenious power-conversion architectures are enabling simpler, denser, more efficient solutions for EVs, data centers, and other critical applications...
SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power densities while reducing solution cost. Meanwhile, silicon...
The results are in—Electronic Design’s readers have spoken. We present the top analog articles of 2024, as well as invite you, our readers, to become contributing authors.
Get up close and personal with some of the world’s most interesting insects and the micro worlds they call home in Nat Geo’s latest series, “A Real Bug’s Life Season 2.”