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How three generations of PCIe are rewriting the rules of high-speed interconnect — from 64 GT/s to a staggering 256 GT/s per lane.
Aug. 20, 2026
Andy Turudic | OpenAI
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Check out the latest stories, videos, and podcasts from the week of Aug. 17, 2026.
Aug. 18, 2026
Data Center Frontier Trends Summit
These shows are co-located at the Renaissance Glendale Hotel in Glendale, AZ
Aug. 4, 2026
Terrapin
Future of Memory and Storage Conference
See what’s going on at FMS 2026.
July 30, 2026

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Learning Resources

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Designing autonomous and electrified heavy equipment? Learn how advanced position sensing overcomes vibration, EMI, moisture, and thermal challenges to improve reliability and...
Oct. 21, 2026
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What if heat and electrons moved more like fluids than diffusive currents? Explore the latest advances in quantum and hydrodynamic transport modeling, and learn how COMSOL Multiphysics...
Sept. 8, 2026
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AI is pushing data centers beyond the limits of traditional cooling. Discover how Baumer’s Cooling Intelligence™ approach combines flow, pressure, temperature, coolant quality...
Aug. 12, 2026
Texas Instruments
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Sponsored by Texas Instruments: Collaboration-driven semiconductor technologies are transforming electric vehicles into a practical, everyday option.
Aug. 11, 2026
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Bill Wong takes a quick look at the BrainChip AKD1000 M.2 module in this Kit Close-Up episode.
Aug. 19, 2026
Real-Time Physical AI: AMD Ryzen AI Embedded X100 & Kria AI SoMs
AMD’s X100 AI processor provides a unified compute platform.
Aug. 14, 2026
How Shielded μModule Power Supplies Drastically Reduce EMI (Live Scope Demo)
Analog Devices’ μModule power regulator technology simplifies implementation, verification, and manufacturing of complex power circuits.
Aug. 11, 2026
Automated LabVIEW Code Gen & Multi-Instrument Debugging
Learn how NI’s Nigel chatbot is simplifying tasks and other operations related to software and test.
Aug. 6, 2026
University of Illinois/Urbana-Champaign
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Implementing transformational “thermotics,” this 3D thermal cloak is based on a lattice-type of materials.
Aug. 21, 2026
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Getting 3D-stacked chiplets to chat with each other is hard, but so is making them connect to other chips in the system.
Aug. 19, 2026
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With demand for batteries booming, Arkema says dry electrode coating could be a key to significant cost savings.
Aug. 13, 2026
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Electrochemical impedance spectroscopy provides deeper insights into battery degradation mechanisms, state-of-charge behavior, and emerging safety risks.
Aug. 12, 2026
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Run Arduino programs on a Raspberry Pi Zero 2 W using PiZZa and Zephyr.
Aug. 24, 2026
Cabe Atwell/EndeavorB2B
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Explore five next-generation M.2 SSDs built for faster PCs, workstations, and AI applications.
Aug. 21, 2026
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Equipped with bidirectional voltage and current blocking capabilities, the bidirectional switches from Infineon significantly shrink PCB footprint and cut component count.
Aug. 20, 2026
Cabe Atwell/EndeavorB2B
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These five EDSFF SSDs are designed to handle today's data center workloads.
Aug. 19, 2026
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Stable component temperatures can conceal a liquid-cooling system about to fail. But closely monitoring coolant can reveal clogged filters and shrinking pump reserves earlier ...
Aug. 24, 2026
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Humanoid robots are moving from controlled demonstrations to factories, warehouses, healthcare, and other human-shared spaces. In these environments, success is defined by sustained...
Aug. 20, 2026
Andy Turudic
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AndyT and his 10-year-old Minion discovered that a trailer full of Stratasys 3D printers and 3D prints was in town and scrambled into Portland to play with the tech.
Aug. 20, 2026
Innatera
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Inside Electronics
Spiking neural networks and neuromorphic processing open the door to ultra-low-power, real-time intelligence.
Aug. 18, 2026