2023 IDEA Awards

Bourns’ new family of circuit-protection devices can dissipate surges of up to 1 or 2 kA.

Phoenix Contact’s Push-X push-in connection technology comes to a new family of terminal blocks.

Quanterion Solutions’ Nonelectronic Parts Reliability Data (NPRD) report delivers details about crucial failure rate and more.

Morse Micro's low-power, MM61xx SoC family provides long-range, Wi-Fi HaLow support.

Nullspace EM can significantly reduce simulation time using multiple GPUs.

Microchip’s PIC32CX-BZ2 wireless microcontrollers work with Bluetooth Low Energy and 802.15.4 technology.

Rockwell Automation’s suite of edge-management solutions support intelligent factory automation.

Rockwell Automation’s FactoryTalk Design Hub includes all of the components needed to design and integrate a factory automation system.

The flagship offering in Lattice’s Avant-E family fits 500,000 logic units into a 15- x 13-mm package.

Nexperia brings interactive datasheets to developers via the internet.

Sponsored by Texas Instruments: How will Bluetooth LE impact the expansion of the connected world? Expect the arrival of new low-cost microcontrollers to push that envelope.

For the third year running, we honor the top innovations in industrial design, engineering, and automation—as nominated and voted upon by you, our readers.

This application-specific digital signal processor and companion piezoelectric-device driver vibrate lens-mounted piezo actuators to clear accumulated water spots and debris from...

With its latest 64-bit RISC-V CPU cores, the P670 and P470, SiFive is putting the focus on compute density.

This sensor driver/receiver IC uses PCB-based differential sensing coils and sophisticated topology to provide high accuracy and noise immunity in harsh environments.