September 30, 2024 - Electronic Design Today

Floorplanning, I/O placement, pinout, and power-stability issues round out the noise-reduction design considerations.

The IAC held the seventh edition of its autonomous racing competition, setting new world autonomous speed records for top speed on a racetrack (184 mph) and fastest passing overtake...

NXP’s i.MX RT700 crossover microcontroller incorporates the eIQ Neutron neural processing unit.

Understanding the problem and possible solutions helps designers produce ICs in which noise performance doesn't hamper functionality.

Innovative reference designs help streamline the development cycles of everything from USB PD products to high-efficiency motor drives. Meanwhile, GM is the first North American...

Evolving technology is driving key trends and design in the automotive industry, from autonomy and zero-emission vehicles to miniaturization.

Altera’s Agilex 3 fills out the low end where low power and low price are major advantages.

Will the mistakes of the 5G rollout repeat with 6G? Examining the reasons why 5G underperformed and avoiding the same pitfalls with 6G.

Tim McCune, President of Linear Systems, reminisces about Silicon Valley’s early days as he retires to spend more time with family—and to SPICE things up a bit.

This room-sized atomic-based arrangement delivers accurate temperature readings within an extremely brief time window.

The wildlife tracking technology, which adheres to the bear's fur, delivers promising results after years of field trials.

Magnetic sensors offer a convenient alternative to their mechanical counterparts. This article discusses the different types of these sensors, their operating principles, and ...

A tailored nanoscale “spin rectifier” is optimized for low-level energy harvesting in specific RF bands.

TTTech Auto partnered with NXP Semiconductors in an attempt to unlock the full potential of automotive connectivity, developing the N4 Network Controller with advanced networking...

Three types of interconnects help to address multi-terabit interconnect challenges: copper, optical, and a newer alternative, RF transmission over plastic cable (e-Tube).