July 7, 2025 - Electronic Design Today

Part 2 of our impromptu chat with Henrik Mannesson, General Manager at Texas Instruments, about the pivotal role of semiconductors and energy storage in the renewable-energy transition...

The harsh reality of AI is that it will eliminate jobs, but Andy submits that the experts are the ones who need to run AI, not “prompt engineers” pretending AI is the expert.

Renesas’ dual-core RA8P1 employs MRAM instead of flash memory, plus it incorporates an Arm AI accelerator.

Vishay’s space-saving device offers low thermal impedance of 0.36°C/W and wettable flanks to improve thermal performance and solderability in industrial applications.

Basic analog building-block components can pull a system together and provide simple yet critical functions.

The VITA 93 QMC standard defines a compact, expandable mezzanine card.

The low figure of merit and enhanced packaging of Toshiba’s new MOSFETs contribute to higher efficiency in high-voltage power system designs.

The dilemma of forklift battery reuse versus recycling: Unlocking the second-life market.

Leveraging silicon carbide, innovative packaging, and advanced chip design, CoolSiC JFETs offer improved system efficiency, robustness, and reliability.

Sponsored by Texas Instruments: Overcome the communications barriers posed by AC ground noise and DC offsets.

The SCiB family of LTO battery cells feature 20,000 cycle lifetimes, low internal resistance, and wide temperature operation.

Gen 4 MOSFETs provide a versatile foundation for various application-optimized bare die, module, and discrete products.

TE Connectivity’s Matt McAlonis discusses how engineers can use the “follow-the-wire” approach to enhance connectivity in eVTOL aircraft.

Top trends this month: Bidirectional power conversion is now “a thing,” power innovations accelerate the evolution of EV body electronics, and Nixie Tubes are cool again.

Understanding the magnetic materials inside devices like chokes and transformers can help guide engineers to make smart selections that lead to significantly higher power density...

Today, legacy equipment manufacturers offer a valuable resource to application OEMs when it comes to dealing with electronics obsolescence: options.

New reference designs for Power Integrations’ 1,700-V-rated InnoSwitch 3-AQ flyback IC deliver 16 to 120 W with high reliability and low BOM count.

From efficient performance to compact design, continuous torque and advanced axial-flux motors keep systems running reliably and seamlessly.

Microchip’s latest power module targeting AI systems includes integrated I2C and PMBus interfaces for flexible configuration and monitoring.

Navitas Semiconductor’s next-generation power-supply unit meets OCP requirements for high-power, high-density server racks.