Engineering Essentials

The VITA 93 QMC mezzanine standard contains details from stacking height to conduction cooling.

NOR flash memory is evolving much in the same way as its cousin, NAND flash: 3D NOR is on the horizon and poised to boost memory densities and dramatically enhance designs.

This article discusses the three most common reliability prediction techniques for the failure rates of ICs and how safety application notes provide such failure-rate information...

As data speeds increase to 224 Gb/s per lane and infrastructure complexity grows, even small signal-integrity issues can degrade performance.

Understanding the magnetic materials inside devices like chokes and transformers can help guide engineers to make smart selections that lead to significantly higher power density...