Texas Instruments
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As the move to physical AI speeds up, how do you make sure these capabilities become broadly accessible and not limited to only high-performance systems?
Bourns and Stackpole
Stackpole current-sense resistors (left) and Bourns thermal jumper chips (right)
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Dreamstime_Suwin-Puengsamrong_88792593 and Ono Sokki
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Check out the latest stories, videos, and podcasts from the week of Jan. 19, 2026.
Jan. 20, 2026
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Find out how virtualization and pre-integrated hardware streamline system implementation.
Jan. 16, 2026
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Check out the latest tech at this year's CES from behind the scenes.
Dec. 29, 2025
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Download the eBook that delves into the manufacturing breakthroughs, rising demand, new applications, and strategic partnerships that are set to revolutionize the future of tactile...
Dec. 17, 2025

Learning Resources

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Join us to learn how to model and optimize phased-array antennas using an RF Module. See how simulation can guide design decisions and improve performance for 5G, 6G, radar, and...
March 12, 2026
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Read this full Top Tips to see how the connector authority continues to improve its performance, reliability, cost, size, and turnaround time to meet the stringent needs of demanding...
Jan. 20, 2026
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Discover how eye pattern analysis with a sampling oscilloscope helps you qualify high-speed optical transceivers. Learn key metrics, jitter and mask tests using Anritsu BERTWave...
Dec. 19, 2025
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Featured Media

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Frederik Dostal explains the rise of the ideal diode and how it can be used to develop more robust power systems.
Jan. 14, 2026
Dual Core SoC Targets Low Power Bluetooth Applications
Nordic’s nRF54LM20A Bluetooth SoC combines RISC-V with an Arm Cortex-M33.
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Jan. 9, 2026
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Inside Electronics Podcast

Technology Advancements

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The 2D devices fabricated using CDimension’s ultra-thin films have demonstrated up to a 1,000X improvement in transistor-level energy efficiency compared to silicon.
Jan. 22, 2026
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Accellera supports cutting-edge EDA standards designed to streamline chip and system development tools.
Jan. 22, 2026
University of California San Diego
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An ancient, fundamental cooling technique gets a new, more-efficient implementation via an innovative fiber matrix.
Jan. 20, 2026
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Industrial AI deployment traditionally requires onsite ML specialists and custom models per location. Five strategies transform this into a standardized installation process.
Jan. 16, 2026

Products and Solutions

The LEGO Group
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LEGO's new SMART Play System blends embedded electronics, sensors, and wireless tech into the familiar classic bricks, creating interactive builds that respond to motion and play...
Jan. 22, 2026
STMicroelectronics
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STMicroelectronics’ new current-sense amplifier supports accurate and reliable monitoring in automotive traction inverters, factory automation and robotics, and servers.
Jan. 22, 2026
Toshiba
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Compact LDO regulators from Toshiba help boost performance while maintaining battery life for mobile devices and wearables.
Jan. 21, 2026
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The latest addition to ST’s VIPerGaN series delivers 65 W in a thermally enhanced QFN package for USB-PD chargers, fast battery chargers, and auxiliary power supplies.
Jan. 20, 2026

Industry Insights

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This article explores the advantages of modern multiplexed ADC architectures and provides practical guidance for selecting and deploying them across a range of industrial process...
Jan. 21, 2026
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Washington and New York are writing legislation requiring a massive refit of CNC and 3D printers or they’re banned from sale. California is also banning machines and files.
Jan. 21, 2026
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The cloud and IoT are still in a stage of growth and development, with technologies continuing to mature and become optimized. Alistair Fulton, CEO of IoT Labs, weighs in on the...
Jan. 13, 2026
National Geographic Partners
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"Pole to Pole" shows how tech and grit capture real discovery at Earth’s extremes.
Jan. 13, 2026